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Laser cutting machine for precision hard and brittle materials
Number of views:
1000
Product serial number
YC-ECLC6045
Quantity
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+
1
Product description
Technical parameter
Product features
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Scope of application
Laser micromachining of ceramics, sapphire, diamond, tungsten steel and other high hardness & high brittleness plane and regular surface instruments
High finishing
- Cutting seam width: 15~30um
- High machining accuracy: ≤±10um
- Good incision quality: smooth incision & small heat-affected zone & few burrs & edge chipping <15um
- Size refinement: minimum product size 100um
Technical certification
- THIS
- ISO9001
- IATF16949
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Contact Us
+86 150 5020 1716 (Mr. Xia)
Headquarters address: No. 335 Jinyang Road (No. 2 Jinxia Road), Lujia Town, Kunshan, Jiangsu Province
+86 188 2436 0600 (Mr. Zhu)
Office in Southern China: Room 210, Wangjiao Mingqihui, No. 2 Hengzeng Road, Chang'an Town, Dongguan, Guangdong Province
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